About This Course
Course Description
The semiconductor industry plays a crucial role in enabling technology across various sectors and has experienced significant growth. While electronic goods currently lead the market, there is emerging potential in communications, medical devices, and the automotive industry.
This course offers an overview of interposer devices used in packaging, including leadframe, ceramic, silicon, glass, rigid substrate, and flexible substrates. As the first course in the intermediate IC packaging curriculum, it equips engineers with essential concepts to tackle challenges they may face in design and manufacturing. IC packaging demands interdisciplinary knowledge, encompassing mechanical, materials, chemical, and electronics engineering.
Course Topics:
- Function of interposer
- Leadframe and its fabrication flow
- Ceramics and its fabrication flow
- Silicon glass interposers
- Rigid substrates and their key processes
- Flex interposers
- Interposer development
Requisite Audience
At least some college-level scientific knowledge
Target Audience
- Sales engineers/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready.
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