About This Course
Course Description
The semiconductor industry plays a crucial role in enabling technology across numerous products and sectors, experiencing significant growth periods. While electronic goods dominate, the communications, medical devices, and automotive sectors are also showing promising potential. This introductory course provides an overview of semiconductor device packaging designed to meet various application demands in terms of size, cost, and performance. Key aspects of package performance—electrical, thermal, and reliability—are also covered to support the expanding semiconductor applications.
As the first course in the IC Packaging curriculum for beginners, it introduces the functions of IC packaging and explores types like BGA, CSP, 3D packaging, and WLP packaging. This foundational knowledge enables engineers to address challenges encountered in design and manufacturing. IC packaging requires an interdisciplinary approach, drawing from mechanical, materials, chemical, and electronics engineering.
Course Objectives
- Explain the functionality of microelectronics packaging.
- Review the various packaging trends over time.
- Describe system packaging and heterogeneous integration.
- Identify the main challenges in packaging.
Requisite Knowledge: None
Target Audience
- Sales engineers/business development executives, college students who are interested in joining the semiconductor industry especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can take advantage of this course to ensure their workforce is ready.
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