Leadframe and Substrate Package Assembly Process

Course Description

This course offers a comprehensive overview of the leadframe and substrate package assembly processes. It begins with an introduction to leadframe and substrate materials before delving into the specifics of the assembly procedures. Participants will learn about the assembly processes for QFP leadframes and flip chip BGA packages, covering key steps such as wire bonding, die attachment, flip chip integration, and package singulation.

Course Objectives

• Identify the materials in the leadframe and rigid substrate structure
• Describe the front-of-line assembly processes and defects
• Explain the end-of-line assembly processes and defects
• Describe the typical leadframe and substrate assembly processes
• Explain how the materials affect the assembly processes

Target Audience

Sales engineers/business development executives, college students who are interested in joining the semiconductor industry, especially in OSAT, EMS, IDM (Package Assembly.) Materials and equipment from industry companies can take advantage of this curriculum to ensure their workforce is ready.

Requisite Audience

At least some college-level scientific knowledge