About This Course
Course Description
The semiconductor industry delivers essential technology that powers a wide range of products and sectors, driving rapid growth. While electronic goods lead the market, industries such as communications, medical devices, and automotive are showing significant potential. This course provides foundational knowledge of Printed Circuit Boards (PCBs), the board assembly process, and soldering.
As the second course in the IC Packaging curriculum for beginners, it equips engineers with the knowledge to tackle more complex challenges in design and manufacturing. IC packaging demands interdisciplinary expertise, encompassing mechanical, materials, chemical, and electronics engineering.
Course Objectives
- Describe how through hole technology and wave soldering functions.
- Explain what surface mount technology and reflow soldering are.
- Summarize PCB and its materials.
- Identify the constituents of solder paste.
- Describe what eutectic solder is.
- Interpret the selection of lead-free solders and its mechanism.
Requisite Knowledge: First or second year college level science background students.
Target Audience
- Sales engineers/business development executives, and college students who are interested in joining the semiconductor industry, especially OSAT, EMS, IDM (Package Assembly). Materials and equipment makers from industry companies can also take up this course to be more workforce ready.
Your Instructors
Google