QA106 Flexible Hybrid Electronics 2.0 based on Fan-Out Wafer Packaging

Course Description

This course provides insights into the transformative impact of innovative packaging paradigms like chiplets and dielets on flexible hybrid electronics (FHE), led by industry expert Dr. Subramanian Iyer of UCLA. It delves into how these compact packages achieve advanced performance in smaller, more adaptable footprints.

The field of Flexible Hybrid Electronics (FHE) is advancing rapidly, especially in medical wellness electronics. Early FHE devices largely adapted Printed Circuit Board (PCB) technology, utilizing thinner PCBs and previous-generation chips on flexible platforms with basic printed wiring. To push the field forward, however, FHE must now integrate advanced packaging and silicon trends, adopting technologies like dielet (chiplet) nodes to scale performance. Key challenges ahead include enhancing interconnects, energy storage, wireless communication, ergonomics, and reliability at lower costs.

Course Objectives

• Understand the challenges and potential roadmap for scaling FHE.
• Explore the adoption of dielet (chiplet) technology in advanced CMOS nodes, including applications for edge-AI.