2D Packaging & Assembly

Overview

Build expertise in the core principles and applications of semiconductor manufacturing, focusing on 2D packaging and assembly. Strengthen your skillset with the critical competencies needed in today’s semiconductor industry and deepen your understanding of advanced packaging technologies.

Course Description

Begin your journey into semiconductor packaging with the 2D Packaging and Assembly micro-badge. Delve into the complexities of material properties and their roles in thermal management, stress mitigation, and electrical performance—the foundations of modern semiconductor packaging.

Designed for forward-thinkers eager to lead in semiconductor advancements, this micro-badge provides hands-on skills to excel in a dynamic industry. Explore essential topics like lead frames, wire bonding, flip-chip technology, underfill substrates, and PCB assembly. Master the terminology, core processes, and tools of 2D packaging and assembly, and leverage advanced materials to optimize package performance.

Session Topics

• Significance of 2D Packaging Techniques
• Lead Frame Types and Applications
• Materials and Manufacturing Processes for Lead Frames
• Basics of Wire Bonding
• Typical Wire Bonding Failure Modes
• Benefits and Challenges of Flip Chip Technology
• Overview of PCB Assembly, Inspection, and Quality Control

Key Skills Covered:

• Lead Frame Assembly Techniques
• Wire Bonding Methods
• Flip Chip Technology
• PCB Assembly Processes