Advanced Diploma in Semiconductor Packaging and OSAT

Context and Significance

The semiconductor industry is experiencing rapid growth, particularly in the Outsourced Semiconductor Assembly and Test (OSAT) and Assembly, Testing, Marking, and Packaging (ATMP) sectors, which are crucial for the development of advanced electronic devices. There is a rising demand for skilled professionals in semiconductor packaging and OSAT/ATMP industries worldwide. Recently, several OSAT companies have emerged in our country, with more expected to follow, highlighting a substantial need for a skilled workforce amid this growth.

The nation’s investment strategy aims to reduce reliance on imports and bolster the ‘Make in India’ initiative, positioning the Semiconductor Packaging Industry for a promising future.

Course Duration: 6 Months
Start Date: January 16, 2025

Quantum Academy is a premier institution established in 1965 by the Ministry of Education, Government of India, and recognized as a deemed university. It features a dedicated ‘Centre for OSAT’ to advance semiconductor packaging and OSAT/ATMP training, ensuring a skilled workforce to meet both domestic and global demands for the growing OSAT industry.

Course Overview

Quantum Academy, is offering an Advanced Diploma in ‘Semiconductor Packaging and OSAT.’ This skill-focused program is designed for engineering and science students looking to build careers in semiconductor technology, encompassing areas such as device packaging, assembly, testing, OSAT services, ATMP services, quality assurance, and both managerial and R&D roles in leading semiconductor companies.

Quantum Academy is committed to delivering a cutting-edge curriculum that incorporates the latest advancements in Semiconductor Packaging and OSAT. Students will gain practical experience in state-of-the-art clean room laboratories, utilizing modern equipment under the guidance of experienced faculty and industry experts.

Program Goals

Program Objectives

1. Technical Expertise: Equip students with a comprehensive understanding and practical experience in semiconductor packaging technologies and OSAT processes.

2. Industry Preparedness: Prepare graduates for careers in the semiconductor industry by providing practical skills and relevant knowledge.

3. Innovation and Problem-Solving: Cultivate the ability to innovate and address complex challenges in semiconductor packaging and testing.

4. Professional Growth: Enhance professional skills such as teamwork, communication, and project management to succeed in a dynamic work environment.

Curriculum Summary

The Advanced Diploma in “Semiconductor Packaging & OSAT” is an all-encompassing program that addresses every facet of semiconductor packaging and assembly. The curriculum is structured into six core modules, each lasting one month. Each module consists of two sessions per working day: Session 1 focuses on interactive theoretical concepts, while Session 2 emphasizes hands-on practical experience.

Educational Objectives

Upon finishing the program, learners will be able to:

• Demonstrate a comprehensive understanding of semiconductor packaging technologies and OSAT processes.
• Apply practical skills in package design, assembly, materials selection, and thermal management.
• Conduct quality control, reliability testing, and failure analysis to ensure the production of high-quality semiconductor devices.
• Enhance packaging efficiency, minimize parasitic effects, and ensure low power consumption.
• Integrate various assembly processes and effectively manage semiconductor packaging workflows.

Qualifications for Enrolment

The program is intended for:

• Engineering diploma holders in Electronics, Electrical, Communication, and Instrumentation.
• Engineering graduates (both recent and current) and postgraduates in Electronics, Electrical, Communication, Instrumentation, Mechatronics, Computer Science, Information Technology, Mechanical Engineering, and related fields.
• Science graduates (both recent and current) with a background in Physics, as well as science postgraduates in any discipline with Physics at the undergraduate level.
• Professionals in the semiconductor industry looking to enhance their skills and knowledge.
• Engineers and technicians who want to specialize in semiconductor packaging and OSAT.
• Scientists and professors interested in pursuing research and development in the semiconductor field.

Course Start Date and Duration

• The course will begin on January 16, 2025.
• The program is a full-time course lasting six months. Candidates have the option to exit after completing any module listed in Section 4, with each module lasting one month. Certificates will be issued for the completed modules, and fees will be adjusted accordingly. This arrangement is advantageous for students currently pursuing an academic degree who wish to gain training or internship experience.
• Upon successfully completing all modules, participants will be awarded an Advanced Diploma in “Semiconductor Packaging and OSAT,” recognized by both industry and academic institutions.

Tuition and Accommodation

• Tuition: ₹36,000 for the full course or a proportional amount based on the number of modules selected. Payment is due before the course start date.
• Accommodation: Provided based on availability, with charges in accordance with institute policies.