AI & Data Bundle

Course Description

This bundle includes two Quantum Academy courses: the Quantum Academy Flexible Power Sources course and the Quantum Academy Hybrid Integration Techniques for Flexible Electronics course. As new materials and processes enable high-performance microelectronics in paper-thin, flexible hybrid electronics (FHE), there’s an increased need for power sources that support ultra-thin and flexible designs.

One of the main challenges is achieving high energy densities as battery thickness decreases, with packaging taking up a larger volume percentage. This complexity is heightened by duty cycles requiring both high power (periodic, large current bursts) and high energy. The Flexible Power Sources course explores these challenges and the emerging power solutions. The second course, on hybrid integration techniques, covers flexible hybrid electronics fabrication at PARC, including printing interconnects, logic circuits, resistors, bonding ICs, and sensor integration.

Course Objectives

• Review challenges and programs for new power supplies emerging for the FHE community’s needs.
• Gain an overview of printing interconnects, fine lines, pads, and pad pitches under 100 µm, logic circuits, and resistors.
• Understand techniques for bonding integrated circuits, sensor integration on flexible substrates, and micron-level accuracy in picking and placing.