Application of Electrical & Thermo-Mechanical Modeling

Overview

Grasp the core principles and applications of semiconductor operations and advanced modeling techniques. Gain essential skills for today’s electronics industry and elevate your approach to package modeling.

Course Description

Step into the semiconductor industry with the Application of Electrical & Thermo-Mechanical Modeling micro-badge. Explore the complexities of electronic package modeling and understand the role of electrical, thermal, and mechanical modeling in modern electronics. Whether you’re an aspiring engineer or an experienced professional, this online course empowers you with advanced modeling techniques in semiconductor packaging.

Designed for forward-thinking professionals, this course equips you with practical skills to excel in a fast-evolving industry. Master key modeling methods, discover thermal management solutions, and harness powerful simulation tools.

Session Topics:

• Electrical Properties and Design Considerations
• Thermal Design and Analytical Models
• Process and Mechanical Design Models
• Electrical, Thermal, and Thermo-Mechanical Analysis and Optimization
• Key Material Parameters and Their Significance in Semiconductor Packaging
• Practical Applications: Simulation and Optimization Techniques

Key Skills Covered:

• Master Image Convolution Techniques
• Design and Structure CNN Models
• Train and Evaluate CNNs Using TensorFlow
• Debug and Customize CNN Code