IC Packaging Beginner Certification

Curriculum Description 

The semiconductor industry plays a vital role in enabling technology across various products and sectors, experiencing significant growth in recent years. While electronics remain the dominant market segment, sectors such as communications, medical devices, and automotive are also showing promising potential. To meet the demands of this expanding industry, this beginner-level curriculum equips learners for a career in semiconductor manufacturing, with a specific emphasis on integrated circuit (IC) packaging.

IC packaging necessitates a blend of knowledge from multiple disciplines, including mechanical, materials, chemical, and electronics engineering. This curriculum adopts an interdisciplinary approach by covering foundational concepts, printed circuit boards (PCBs), board assembly, soldering techniques, and the assembly of leadframes and substrates. Engineers who complete this certification will be better prepared to tackle real-world challenges encountered during design and manufacturing processes.

Upon completion of the training, learners must pass a final exam to obtain their certification. The exam consists of 100 questions, and learners have three attempts to achieve a passing score of 75%. If a learner does not pass after three attempts, re-enrollment in the curriculum will be required. This certification, issued by SEMI, is valid for three years.

The IC Packaging Beginner’s Certification comprises three courses. While each course can be purchased individually, this bundle is the only option that includes a summative exam.

Curriculum Objectives 

• Summarize introductory concepts of integrated chip packaging
• Explain PCB, board assembly, and soldering functions and constituents
• Identify various assembly processes

Curriculum Duration

3.5 hours, Certification exam 1.5 hours

Requisite Knowledge 

At least some college-level scientific knowledge