About This Course
Overview
Master the key applications and principles behind semiconductor manufacturing, focusing on advanced materials selection for thermo-mechanical and electrical performance. Build essential skills for today’s semiconductor industry and transform your understanding of material properties.
Course Description
Enter the semiconductor industry with the Materials Selection for Thermo-Mechanical & Electrical Performance micro-badge. Discover the complexities of material properties and the applications of thermal and electrical characteristics, fundamental to modern semiconductor manufacturing.
Tailored for forward-thinking professionals ready to shape the future of semiconductor technology, this micro-badge provides the hands-on skills to excel in a rapidly evolving field. Explore essential topics such as thermal conductivity, electrical conductivity, mechanical strength, and thermal expansion coefficients, and leverage advanced tools and platforms to maximize performance.
Session Topics:
- Thermal Conductivity, Electrical Conductivity, Mechanical Strength, and Thermal Expansion Coefficients
- Impact of Material Properties on Performance and Reliability of Packages
- Thermo-Mechanical Challenges in Semiconductor Packaging
- Electrical Challenges and Isolation Needs
- Techniques for Material Evaluation in Semiconductor Packages
- Traditional vs. Advanced Materials in Semiconductor Packaging
- Practical Approaches to Material Selection
Key Skills Covered:
- Understanding Core Thermo-Mechanical and Electrical Properties
- Analyzing Thermo-Mechanical and Electrical Challenges in Packaging
- Evaluating and Selecting Optimal Materials for Specific Applications
- Applying Material Science Principles to Improve Package Performance
Your Instructors
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