QA103 Hybrid Integration Techniques for Flexible Electronics

Course Description

This course covers advanced techniques developed at the Palo Alto Research Center for fabricating flexible hybrid electronics. Key topics include printing interconnects, logic circuits, and resistors, bonding integrated circuits, and integrating diverse sensor types. These methods are demonstrated with examples, showcasing wireless sensor prototypes on flexible substrates and the development of electronics embedded in textiles.

Course Objectives

• Outline techniques and practices at the Palo Alto Research Center (PARC) for fabricating flexible hybrid electronics.
• Explain the principles behind logic circuits and resistors in flexible systems.
• Demonstrate methods for bonding integrated circuits effectively.
• Describe techniques for integrating diverse sensors on flexible substrates without compromising performance.