Semiconductor Manufacturing I

Course Description

Semiconductor manufacturing is a multi-step process with intricate details. This course focuses on two essential stages: silicon wafer fabrication and semiconductor deposition. The silicon wafer fabrication process covers single-crystal growth, wafer grinding, slicing, edge grinding, lapping, etching, and polishing. The semiconductor deposition section explores key deposition techniques critical to semiconductor manufacturing. To support an engaging learning experience, the course includes interactive quizzes to help learners assess their knowledge and reinforce understanding of the visually rich content.

Learning Objectives

• Describe the various steps involved in the fabrication of silicon wafers, including crystal growth, slicing, lapping etching, and polishing.

• Recognize the types of epitaxy and the process involved in creating them.

•  Identify the different types of deposition processes used to create thin films and patterns on silicon wafers, and the application of each method.

• Explain the basic principles of the different types of deposition processes, such as CVD, PVD, ALD, ECD, and SOD.

Course Duration: 2 hours

Target Audience: Quality, manufacturing, engineering, designing, testing, purchasing, and sales functions at organizations that require an understanding of how semiconductor devices are manufactured.