Semiconductor packaging – Analysis, Design, Assembly, Test and Manufacturing
About This Course
Program Description
The semiconductor industry is experiencing exponential growth, with a primary emphasis on advancing semiconductor technology and a secondary focus on packaging solutions. This course offers a comprehensive overview of packaging technology, covering critical aspects such as analysis, design, assembly, testing, and manufacturing processes in semiconductor packaging.
Learning Format: Hybrid
Duration:1 month (Hybrid)
Program Fee: ₹To be published soon (inclusive of tax)
Education Qualification
B.E or BSc in Electronics & Communication (completed degree)- completed Fresh graduates and Engineers
Lead Faculty
To be published soon
Course Offered By
Learning Objectives
Hybrid
Material Includes
- 1 month (Hybrid)
Requirements
- Bachelor's degree (B.E. or B.Sc.) in Electronics & Communication. Open to recent graduates and engineers with a completed degree.
Curriculum
1h
Module1 – Overview of IC Design
In person class supported by materials. Duration : 4 hours
Module 2 – Introduction to Packaging
In-person class with supporting materials provided. Duration : 4 hours
Module 3 – Conventional Packaging
In-person class with supporting materials provided. Duration: 4 hours.
Module 4 – Advanced Packaging Techniques
In-person class with supporting materials provided. Duration: 4 hours.
Module 5 – Overview of the OSAT Industry
In-person class with supporting materials provided. Duration: 4 hours.
Module 6 – Comprehensive Overview of Semiconductor Assembly and Test Facilities
In-person class with supporting materials provided. Duration: 4 hours.
Module 7 – Safety Protocols in Assembly and Test Facilities
In-person class with supporting materials provided. Duration: 4 hours.
Module 8 – Clean Room Practices: Dos and Don’ts
In-person class with supporting materials provided. Duration: 4 hours.
Module 9 – Supply Chain Logistics
Module 10 – Fundamentals of Equipment Maintenance (PM Levels and Breakdown Maintenance): Equipment Downtime Dos
Module 11 – Utility Maintenance
In-person class with supporting materials provided. Duration: 4 hours.
Module 12 – Fundamentals of Quality and Reliability
In-person class with supporting materials provided. Duration: 4 hours.
Module 13 – Assembly and Test Line Operations: Essential Success Factors
In-person class with supporting materials provided. Duration: 4 hours.
Module 14 – Introduction to PCB Basics
In-person class with supporting materials provided. Duration: 8 hours.
Module 15 – Fundamentals of Package Design
In-person class with supporting materials provided. Duration: 8 hours.
Module 16 – Package Design Simulations
In-person class with supporting materials provided. Duration: 8 hours.
Your Instructors
Google