Semiconductor Packaging, Assembly, and Test

Overview

Master the applications and core principles behind semiconductor manufacturing, packaging, assembly, and testing. Build the critical skills demanded by today’s semiconductor industry and elevate your understanding of cutting-edge semiconductor technology. This Level 2 badge provides hands-on expertise to help you excel in a fast-evolving field.

Key Skills Covered

• 2D Electronic Packaging: Processes for chip packaging, PCB assembly, and adherence to JEDEC/IPC standards
• Performance Evaluation: Assess thermo-mechanical and electrical performance
• Modeling Techniques: Utilize electrical and thermo-mechanical modeling
• Quality & Reliability Testing: Conduct rigorous testing and leverage advanced tools for data

Complete any single micro-badge or all four to earn the full badge! See details on each micro-badge below.

2D Packaging and Assembly

Dive into the complexities of 2D packaging and assembly—from wafer processing to chip packaging and PCB assembly—and discover their roles in thermal management, stress reduction, and electrical performance, essential foundations of modern semiconductor packaging.

Selecting Materials for Thermo-Mechanical and Electrical Performance

Discover the critical material properties at the heart of modern semiconductor manufacturing, focusing on thermal and electrical characteristics. Explore essential topics like thermal conductivity, electrical conductivity, mechanical strength, and thermal expansion coefficients, while leveraging advanced tools and platforms for deeper insights.

Applying Electrical and Thermo-Mechanical Modeling

Gain a deep understanding of the principles and applications driving semiconductor operations and advanced modeling techniques. Build essential skills for today’s electronics industry and elevate your approach to package modeling.

Quality and Reliability Testing with Data Analysis

Develop a thorough understanding of how data analysis enhances quality, performance, and reliability in modern electronics. Master key testing techniques, explore effective failure analysis methods—both destructive and non-destructive—and leverage advanced tools for statistical data analysis.

What you’ll earn!

Participants will earn a digital micro-badge from the Ira A. Fulton Schools of Engineering for each micro-badge completed and the full badge when completing all four micro-badges. Participants will also qualify for Continuing Education Units (CEU).