Test & Data Analysis for Quality & Reliability

Overview

Develop a solid understanding of the core principles and applications behind semiconductor operations and advanced modeling techniques. Gain the essential skills demanded by today’s electronics industry and elevate your approach to package modeling.

Course Description

Dive into the semiconductor industry with the Test & Data Analysis for Quality & Reliability course, where you’ll uncover the complexities of electronic package testing. Gain a thorough understanding of how data analysis enhances quality, performance, and reliability in modern electronics. Tailored for forward-thinking professionals, this course provides practical skills for success in a dynamic field. Master key testing techniques, explore effective failure analysis methods, and leverage powerful data analysis tools.

Session Topics:

• Testing Electronic Packages
• Manufacturing Data and Statistical Process Control (SPC)
• Conducting Failure Modes, Mechanisms, and Criticality Assessment (FMECA)
• Quality and Reliability Test Standards (JEDEC, Mil-Spec, IPC) for Electrical Performance, Thermal Cycling, Preconditioning, and Accelerated Life Tests (HALT, HAST)
• Failure Analysis Techniques: Destructive and Non-Destructive Methods (e.g., CSAM, FIB, Cross-Sectioning, Microscopy, CT Tomography)
• Test Data Analysis Techniques, including Statistical Distributions like Weibull Analysis

Key Skills Covered:

• Data Collection and Analysis in Packaging Processes
• Applying Failure Modes, Effects, and Criticality Analysis (FMECA)
• Interpreting Test Conditions for Quality and Reliability Assessment
• Statistical Analysis of Test Data (e.g., HALT, HAST) Using Methods like Weibull Distributions